Next Chapter Meeting:
Please email Ryan Aldridge (email@example.com) if you plan to attend.
February 23, 2017
5:30 - 6:00 - Social time.
Attendance is free of charge to all IEEE Members and Non-Members
Location: GVSU EMC Center (Click through for .pdf map)
Impact of PCB material properties on EMC and Signal-Integrity Performance
This presentation will focus on a case study of a product suffering from DDR3 Signal-Integrity challenges and EMC failures in GPS band, which were linked to the PCB material properties.
We will demonstrate the application of a multi-domain approach: time, frequency and EMC, used to determine the source of the issue. We will illustrate how both measurement (Oscilloscope, TDR and VNA) and simulation (Hyperlynx) methods can be used to understand the observed behavior and potential mechanisms attributed to the issue. Finally we will demonstrate a test method that can be used to pre-screen samples from PCB suppliers.